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Enertron primarily uses three bonding methods to manufacture a bonded fin heat sink. They are: epoxy bonded heat sinks, solder bonded heat sinks, and press fit bonded heat sinks.
A heat pipe can be used to assist with the bonded fin heat sink design, where a heat pipe can be used to carry the heat to an area where the airflow is adequate and there is enough space available for bonded fin heat sink. In a sealed case, a heat pipe can be used to bring the heat from inside heat source to the enclosure wall, where a bonded fin heat sink can be attached to dissipate the heat to the environment.